Confocal Laser Scanning Microscope
Olympus America is proud to offer the LEXT, Confocal Laser Scanning Microscope designed for sub-micron imaging, with outstanding 120nm resolution and accurate three-dimensional measurement. Magnification power from 120x to 14,400x satisfies the needs of researchers working between the limits of conventional optical microscopes and scanning electron microscopes (SEM).
Features and Benefits:
The LEXT OLS3100 combines a 408nm laser with optics specifically designed for operation at the 408 wavelength to optimize image quality and limit aberrations. Olympus software provides a simple user interface, fast processing and advanced analysis in a single solution. Optional modes include Brightfield, Darkfield and Differential Interference Contrast (DIC) Microscopy. The confocal laser DIC mode is especially useful for highlighting subtle textural variations during surface analysis.
* Outstanding resolving power
The 408nm laser diode is combined with specially designed optics to provide optimized image quality and minimized aberrations. The resolving power is enhanced by confocal optics featuring an optimized circular pinhole and a high speed XY scanner developed from Olympus MEMS technology. The result is world-leading spatial resolution that clearly resolves patterns of 120nm line-width. Also, the LEXT does not require any sample preparation such as dicing, cleaving, or deposition. Therefore, the LEXT provides efficient operation with a faster time to solution than a typical Scanning Electronic Microscopes (SEM).
* Simultaneous 3D and “true color” image acquisition
A unique feature of LEXT is its ability to image samples in 3D and “true color” by combination of the laser image with the full color brightfield image using the systems unique software capabilities. In addition DIC can also be combined with the confocal image to provide identification of minute level differences on the surface of a specimen. The range of contrast methods is completed by the optional darkfield capability for detection of scratches and cracks.
* High precision 3D measurement
2D measurement: Best suited for measurement of 1.5mm to 1µm widths. Both line-width and geometric measurements (e.g. diameter of a circle) are possible. 3D measurement: Best suited for height measurements of 1mm to 0.5µm bumps. A volume, capacity, surface area, etc. can be measured in 3D. The thickness of a thin transparent film can also be measured. Roughness analysis: Best suited for the analysis of roughness of about Rz 0.1µm. Analysis of line and surface roughness is possible. Noncontact probing leaves specimen free of scratches.
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Microscopes & Imaging Systems:
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